Electronic Semiconductor

The electronics and semiconductor industries place extremely stringent demands on sealing products that protect sensitive electronic components and assemblies from contamination, moisture, chemicals and mechanical damage. Seals play a key role in the semiconductor manufacturing process, ensuring equipment reliability and performance.

Seals materials

Silicone rubber (VMQ): excellent high temperature resistance, oxidation resistance and electrical insulation, suitable for high temperature processes in semiconductor manufacturing.

Fluorine rubber (FKM/Viton): excellent chemical resistance and high temperature resistance, suitable for chemical processing and high temperature environment.

Polytetrafluoroethylene (PTFE): excellent chemical resistance, low coefficient of friction and non-adhesion for high purity applications.

Polyetheretherketone (PEEK): excellent chemical resistance, high temperature resistance and mechanical strength, suitable for high-end semiconductor equipment.

Hydrogenated Nitrile Butadiene Rubber (HNBR): excellent heat, oil and abrasion resistance, suitable for harsh environments.

Ceramic materials: such as alumina, silicon nitride, etc., with excellent high temperature resistance and chemical stability, suitable for extreme environments.

Types of seals

O-ring: used for static and dynamic sealing, suitable for various media and pressure conditions.

Gaskets: used for flat seals, such as flange connections, requiring chemical resistance and pressure resistance.

Seals: used for sealing of containers and equipment, such as wafer boxes, reactors, etc.

Diaphragms: Used for sealing of pumps and valves, capable of isolating the medium from the external environment and preventing cross-contamination.

Bellows: used for sealing in high temperature and high pressure environments, such as gas pipelines and chemical transport.

Seals design

High purity design: Seals need to be designed in the form of no particles, no precipitates, no contamination to meet the high purity requirements of the semiconductor industry.

Corrosion-resistant design: seals need to be able to resist a variety of chemicals, including acids, alkalis, solvents and so on.

Pressure-resistant design: Seals need to be able to maintain sealing performance under high-pressure environments to prevent leakage.

Temperature resistant design: seals need to be able to maintain stable performance in high or low temperature environment.

Seals manufacturing and processing

Precision machining: Seals need to be precision machined to ensure dimensional accuracy and surface finish to ensure sealing performance.

Surface treatment: The surface of seals may require special treatment, such as polishing, coating, etc., to improve corrosion and wear resistance.

Cleaning and sterilisation: Seals in the semiconductor industry require stringent cleaning and sterilisation to ensure sterility and contamination free.

Seasl testing and validation

Chemical resistance test: Seals are tested for corrosion resistance in a simulated chemical environment.

Pressure Resistance Test: Test the pressure resistance of seals under simulated high pressure conditions.

Temperature resistance test: Test the temperature resistance of seals under simulated high or low temperature conditions.

High purity test: In the semiconductor industry, seals need to pass high purity tests such as particle precipitation test and chemical precipitation test.

Examples of seal applications

Wafer processing equipment: High purity silicone rubber seals such as VMQ O-rings and gaskets are used.

Chemical Vapour Deposition (CVD) equipment: use high temperature and chemical resistant seals such as FKM O-rings and PTFE gaskets.

Lithography equipment: use high precision seals such as PEEK bellows and ceramic seals.

Ion implantation equipment: use radiation and high temperature resistant seals such as HNBR O-rings and ceramic seals.

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